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Volume 3, Issue 2
March 2003


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A Symphony of Data

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The Lighter Side of Next-Generation Lithography

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The science-fiction fantasy of nanotechnology — building novel structures, devices, and materials at the atomic or molecular scale — is becoming a reality. For the great potential of nanoscience and nanotechnology to be fully realized, however, research efforts must cross many disciplines, from electrical engineering, mechanical engineering, materials science, and computer science to bioengineering, chemistry, and physics.

Nowhere is this cross-disciplinary approach fostered more than at UC Berkeley. Each month, Lab Notes is proud to present the work of nanotechnology researchers from the College of Engineering and our collaborators across the campus.



The Lighter Side of Next-Generation Lithography
by David Pescovitz

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optic

In this illustration, the height — about 13.4 nanometers — is a measure of an EUVL optic's deviation from perfect shape.
Courtesy Lawrence Berkeley National Laboratory

At the dawn of the Digital Age, Silicon Valley pioneer and Intel co-founder Gordon Moore predicted that the number of transistors on an integrated circuit, and hence, its speed, would double every year or at least every 18 months. He was right, more or less. But soon, Moore's law will collide with a much less flexible set of laws — the laws of physics. Within the next decade, the technology used to manufacture integrated circuits, known as optical lithography, may reach its practical limits. Quite simply, today's best commercial fabrication methods — which produce transistors 130 nanometers in size using light — probably won't be dexterous enough to shrink transistors smaller than 50 nanometers.

"When the industry is ready to make nanotransistors, how will they mass produce them?" asks Jeffrey Bokor, a professor of Electrical Engineering and Computer Sciences at UC Berkeley.

Bokor is a pioneer in extreme ultraviolet lithography (EUVL), widely accepted as the heir to the optical lithography throne. For nearly 15 years, Bokor has been helping EUVL get ready for prime time so that computers will continue to grow in power even as they shrink in size and price. Most recently, he and a team of collaborators from UC Berkeley's Center for X-Ray Optics, the Virtual National Laboratory, and Lawrence Berkeley National Laboratory's (LBNL) Advanced Light Source built one of the most accurate optical system testing machines in the world to put EUVL technology through its paces.

Goldberg, Bokor, and Naulleau

Jeff Bokor (center) with collaborating LBL scientists Ken Goldberg (left) and Patrick Naulleau (right) beside Beamline 12.0 at LBL's Advanced Light Source where many of the EUVL experiments are conducted.
Courtesy Lawrence Berkeley National Laboratory

In today's optical lithography technology, light shining through a glass mask (essentially a stencil of the chip's features) projects the chip pattern onto a silicon wafer coated with photoresist, an organic film that hardens when exposed to light. In the areas not exposed, the film can be washed off, leaving bare areas where a previously deposited film of insulator or conductor can then be etched away. By repeating this process on many different layers, the transistors and wires that make an IC chip are formed. The shorter the wavelength of light projecting through the mask, the smaller the features on the chip.

Extreme Ultraviolet Lithography offers a wavelength of 13 nanometers — 10 times shorter than today's best optical alternatives — and will enable the patterning of chip features smaller than 50 nanometers. EUVL works by using a series of mirrors, rather than lenses, to bounce the extreme ultraviolet light off a "reflective mask" and onto the wafer.

"The precision with which you have to transfer that pattern onto the wafer is much different than making an image that looks good to your eye," Bokor says. "Your eye and brain are very forgiving but integrated circuits are not."

Because the wavelength of EUVL is 13 nanometers, the surface of the mirrors must be fabricated and aligned to sub-nanometer tolerances.

"You can't possibly make something that precise without having the capability to measure it," Bokor adds.

Using a beam from LBL's Advanced Light Source (ALS), one of the world's brightest sources of ultraviolet light, the researchers designed and built an optical measuring device known as an interferometer. The groundbreaking device is capable of detecting deviations in EUV optics smaller than the radius of a hydrogen atom.

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"We measured the first real EUV optics developed out of a huge industry-wide EUV lithography program and determined that it had very high performance," says Bokor says. "We established the gold standard for EUV lithography optics."

Also thanks to the ALS, Bokor and his colleagues developed a method to identify defects in the masks used to pattern the chips. The EUV masks' susceptibility to defects, caused, for example, by dust, is a huge industry concern; one defect can ruin every chip patterned by that mask. So far though, Bokor says this theoretical concern hasn't proven to be a "show stopper" for EUV lithography.

And most recently, the researchers began focusing on the light-sensitive photoresist used to coat the silicon. The goal, Bokor says, is to help commercial vendors evaluate whether their resist is capable of responding at the resolution necessary for the EUV fabrication of nano-scale transistors. To this end, his research group constructed an experimental EUV lithography system — again the only one of its kind in the world — that runs off the ALS and is capable of producing 30 nanometer features on silicon.

"The microchip industry doesn't like to take risks," he says. "But we can help give the industry the confidence to make the big leap to EUV lithography."


Related Sites

Jeffrey Bokor's Semiconductor Research Group

LBL Advanced Light Source


Lab Notes is published online by the Public Affairs Office of the UC Berkeley College of Engineering. The Lab Notes mission is to illuminate groundbreaking research underway today at the College of Engineering that will dramatically change our lives tomorrow.

Editor, Director of Public Affairs: Teresa Moore
Writer, Researcher: David Pescovitz
Designer: Robyn Altman

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© 2003 UC Regents. Updated 2/28/03.